Xiaobang Shang attained a BEng degree (First Class) in Electronic and Communication Engineering in 2008 and a PhD degree in Microwave Engineering in 2011 from the University of Birmingham. After graduating he continued working at the University of Birmingham as a Research Fellow.
In 2017, Xiaobang joined the NPL as a Senior Scientist, researching into electrical measurements at microwave, millimetre-wave, and terahertz frequencies, for future telecoms and quantum applications. He was promoted to Principal Scientist in 2023. He was the Coordinator for EMPIR TEMMT project (2019 – 2022), a large-scale EU metrology project involving 19 partners globally.
Dr Shang is a Visiting Professor at the University of Manchester (School of Engineering) and a Senior member of the IEEE. He has authored or co-authored over 120 publications. He was the recipient of several prestigious awards including the IEEE MTT-S Outstanding Young Engineer Award in 2025, the Roberto Sorrentino Prize in 2022, the IEEE Tatsuo Itoh Award in 2017, the ARMMS Steve Evans-Pughe Prize in 2017, and the ARFTG Roger Pollard Microwave Measurement Student Fellowship in 2009.
Dr Shang actively participates in international activities, including:
- Representative: European Microwave Association (EuMA) General Assembly, representing Group 4 countries (UK, Ireland, Gibraltar, Malta). (2022 – 2024)
- Associate Editor: IEEE Microwave and Wireless Technology Letters (2020 – 2024)
- Guest Editor: Special Issue entitled “Measurement and Characterization of THz Systems and Their Key Radio Components” for IEEE Transactions on Terahertz Science and Technology (publication May 2025)
- Member: IEEE MTT-S TC-3 ‘Microwave Measurements’ Technical Committee (2021 – present)
- Member: IEEE MTT-S TC-21 ‘Terahertz Technology and Applications’ Technical Committee (2022 – present)
- Member: IEEE P2822 standard Working Group “Recommended Practice for Microwave, Millimeter-wave and THz On-Wafer Calibrations, De-Embedding and Measurement” (2021 – present)
- Chair: IET Colloquium on Millimetre-wave and Terahertz Engineering and Technology in 2019, 2021, and 2022
- Operations Director and Automotive Forum Co-Chair: European Microwave Week (EuMW) 2021 Conference
- TPC member: EuMW 2025, EuMW 2024, EuMW 2022, EuMW 2021, IEEE iWEM 2021, UCMMT 2021, IEEE ISNE 2019, and EuMW 2026 (General TPC Chair)
Areas of interest
- On-wafer measurements (at room temperature and cryogenic temperatures)
- Material characterisations
- Millimetre-wave and terahertz circuits
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Selected publications – see Dr Shang’s Google Scholar page for the full list
- X. Shang, M. Naftaly, J. Skinner, et al., “Interlaboratory Comparison of Dielectric Measurements from Microwave to Terahertz Frequencies Using VNA-based and Optical-based Methods,” IEEE Transactions on Microwave Theory and Techniques, Early access available. DOI: 10.1109/TMTT.2024.3399879.
- 54 co-authors (including X. Shang), “The 2023 Terahertz Science and Technology Roadmap,” Journal of Physics D: Applied Physics, vol. 56, no. 22, 223001, pp. 1-66, 2023. DOI: 10.1088/1361-6463/acbe4c.
- X. Shang, N. Ridler, D. Stokes, et al., "Some Recent Advances in Measurements at Millimeter-Wave and Terahertz Frequencies: Advances in High Frequency Measurements," IEEE Microwave Magazine, vol. 25, no. 1, pp. 58-71, Jan. 2024. DOI: 10.1109/MMM.2023.3321516.
- M. Shu, X. Shang, N. Ridler, A. Calleau, A. I. Dimitriadis and A. Zhang, "Improvements to Millimeter-wave Dielectric Measurement Using Material Characterization Kit (MCK),” IEEE Transactions on Instrumentation and Measurement, vol. 73, pp. 1-8, 2024, Art no. 6001108. DOI: 10.1109/TIM.2023.3332341.
- X. Shang, N. Ridler, U. Arz, et al., "Interlaboratory Investigation of On-wafer S-parameter Measurements from 110 GHz to 1.1 THz," 2023 53rd European Microwave Conference (EuMC), Berlin, Germany, 2023, pp. 624-627. DOI: 10.23919/EuMC58039.2023.10290550.
- D. Stokes, Y. Liu, X. Shang, N. Ridler, “Millimeter-wave and Terahertz Power Meter Characterization at W-band Frequencies,” Journal of Infrared, Millimeter, and Terahertz Waves, vol. 44, pp. 134-150, 2023. DOI: 10.1007/s10762-022-00898-8.
- Y. Zhang, J. Xu, X. Shang, “3-D Printed Filtering Crossover using Ellipsoidal Cavities,” IEEE Microwave and Wireless Technology Letters, vol. 33, no. 2, pp. 153-156, February 2023. DOI: 10.1109/LMWC.2022.3214759.
- Y. Zhang, X. Shang, F. Zhang and J. Xu, "A 3-D Printed Ku-Band Waveguide Filter Based on Novel Rotary Coupling Structure," IEEE Microwave and Wireless Technology Letters, vol. 33, no. 1, pp. 35-38, Jan. 2023. DOI: 10.1109/LMWC.2022.3194367.
- Y. Yu, Y. Wang, T. Skaik, T. Starke, X. Shang, M. J. Lancaster, P. Hunyor, P. Huggard, H. Wang, Q. S. Cheng, “D-band Waveguide Diplexer Fabricated Using Micro Laser Sintering,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 9, pp. 1446-1457, Sept. 2022. DOI: 10.1109/TCPMT.2022.3204887.
- Y. Gao, X. Shang, L. Li, C. Guo, Y. Wang, “Integrated Filter Amplifiers”, IEEE Microwave Magazine, vol. 23, no. 6, pp. 57-75, June 2022. DOI: 10.1109/MMM.2022.3155034.
- D. Ma, X. Shang, N. Ridler, W. Wu, “Assessing the Impact of Data Filtering Techniques on Material Characterization at Millimeter-Wave Frequencies,” IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1-4, 2021. DOI: 10.1109/TIM.2021.3067224.
- N. Ridler, S. Johny, M. Salter, X. Shang, W. Sun, A. Wilson, “Establishing Waveguide Lines as Primary Standards for Scattering Parameter Measurements at Submillimetre Wavelengths”, Metrologia, vol. 58, no. 1, Art no. 015015, 2021. DOI: 10.1088/1681-7575/abd371.
- X. Shang, N. Ridler, J. Ding, M. Geen, “Introductory Guide to Making Planar S-parameter Measurements at Millimetre-wave Wavelengths”, Best Practice Guide, January 2021. https://doi.org/10.47120/npl.9001.
- S. Shin, X. Shang, N. Ridler, S. Lucyszyn, “Polymer-based 3-D Printed 140-220 GHz Low-cost Quasi-optical Components and Integrated Subsystem Assembly,” IEEE Access, vol. 9, pp. 28020-28038, 2021. DOI: 10.1109/ACCESS.2021.3057606.
- N. Ridler, S. Johny, X. Shang, W. Sun, A. Wilson, “Comparing Standardized and Manufacturers’ Interfaces for Waveguides used at Submillimetre-wave Frequencies,” IEEE Transactions on Terahertz Science and Technology, vol. 10, no. 5, pp. 453-459, Sept. 2020. DOI: 10.1109/TTHZ.2020.3010122.
- Y. Wang, X. Shang, N. Ridler, M. Naftaly, A. Dimitriadis, T. Huang, W. Wu, “Material Measurements Using VNA-based Material Characterization Kits Subject to Thru-Reflect-Line Calibration,” IEEE Transactions on Terahertz Science and Technology, vol. 10, no. 5, pp. 466-473, Sept. 2020. DOI: 10.1109/TTHZ.2020.2999631.
- Y. Wang, X. Shang, N. M. Ridler, T. Huang and W. Wu, "Characterization of Dielectric Materials at WR-15 Band (50–75 GHz) Using VNA-Based Technique," IEEE Transactions on Instrumentation and Measurement, vol. 69, no. 7, pp. 4930-4939, July 2020. DOI: 10.1109/TIM.2019.2954010.
- C. Guo, Y. Dhayalan, X. Shang, M. J. Lancaster, H. Wang, J. Xu, J. Powell, Y. Wang, B. Alderman, and P. G. Huggard, “A 135-150 GHz frequency tripler using SU-8 micromachined WR-5 waveguides,” IEEE Transactions on Microwave Theory and Techniques, vol.68, no.3, pp.1035-1044, March 2020. DOI: 10.1109/TMTT.2019.2955684.
- R. Lozar, M. Ohlrogge, R. Weber, N. Ridler, X. Shang, T. Probst, and U. Arz, “A comparative study of on-wafer and waveguide module S-parameter measurements at D-band frequencies,” IEEE Transactions on Microwave Theory and Techniques, vol.67, no.8, pp. 3475-3484, August 2019. DOI: 10.1109/TMTT.2019.2919538.
- 19 co-authors (including X. Shang), “Best Practice Guide for Planar S-Parameter Measurements using Vector Network Analysers”, Best Practice Guide, 2019, http://dx.doi.org/10.7795/530.20190424B.
- H. Yang, Y. Dhayalan, X. Shang, M. J. Lancaster, B. Liu, H. Wang, M. Henry, P. G. Huggard, “WR-3 waveguide bandpass filters fabricated using high precision CNC machining and SU-8 photoresist technology,” IEEE Transactions on Terahertz Science and Technology, vol.8, no.1, pp.100-107, January 2018. DOI: 10.1109/TTHZ.2017.2775441.
- C. Guo, X. Shang, M. J. Lancaster, J. Xu, J. Powell, H. Wang, B. Alderman, and P. G. Huggard, “A 135-150 GHz frequency tripler with waveguide filter matching,” IEEE Transactions on Microwave Theory and Techniques, vol.66, no.10, pp.4608-4616, October 2018. DOI: 10.1109/TMTT.2018.2855172.
- C. Guo, X. Shang, M. J. Lancaster, J. Xu, J. Powell, H. Wang, K. Parow-Souchon, M. Henry, C. Vegas, B. Alderman, and Peter G. Huggard, “A 290-310 GHz single sideband mixer with integrated waveguide filters,” IEEE Transactions on Terahertz Science and Technology, vol.8, no.4, pp.446-454, July 2018. DOI: 10.1109/TTHZ.2018.2841771.
- X. Shang, P. Penchev, C. Guo, M. J. Lancaster, S. Dimov, M. Favre, M. Billod, E.Rijk, “W-band waveguide filters fabricated by laser micromachining and 3-D printing,” IEEE Transactions on Microwave Theory and Techniques, vol.64, no.8, pp.2572-2580, 2016. DOI: 10.1109/TMTT.2016.2574839.
- X. Shang, Y. Tian, M. J. Lancaster, “A SU8 micromachined WR-1.5 band waveguide filter,” IEEE Microwave and Wireless Components Letters, vol.23, no.6, pp.300-302, 2013. DOI: 10.1109/LMWC.2013.2260733.
- X. Shang, Y. Wang, W. Xia, M. J. Lancaster, "Novel multiplexer topologies based on all-resonator structures," IEEE Transactions on Microwave Theory and Techniques, vol.61, no.11, pp.3838-3845, 2013. DOI: 10.1109/TMTT.2013.2284496.
- X. Shang, M. Ke, Y. Wang, M. J. Lancaster, “WR-3 band waveguides and filters fabricated using SU8 photoresist micromachining technology,” IEEE Transactions on Terahertz Science and Technology, vol.2, no.6, pp.629-637, 2012. DOI: 10.1109/TTHZ.2012.2220136.
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