Ling works within the area of Electronics Interconnection on a range of issues concerned with circuit reliability.
Ling joined NPL in 1997. Her expertise covers the studying of different electrochemical failure mechanisms of electronic circuits caused by metal corrosion using different techniques, Surface Insulation Resistance (SIR) testing, Conductive Anodic Filament (CAF) testing, AC impedance technique, and Ionic Contamination testing. Ling also investigated the effect of new solder alloys, PCB finish materials and component terminations on solderability using the wetting balance method.
She has also extended her expertise to electronic reliability under high application voltage (up to 1000V) and condensation harsh environment.
Ling is actively engaged with UK and international industry through her role as the head of Measurement Service for Electronics.
She has published numerous peer-reviewed papers in high impact journals (e.g., J. of The Electrochemical Society, J. Materials Research and Soldering & Surface Mount Technology), conference papers, NPL(A) reports and Good Practice Guides.
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